Microsoft’s next HoloLens will reportedly be powered by a Qualcomm Snapdragon processor. The device, which has so far been quite under the radar, is expected to launch sometime in the second quarter of 2019.

According to Neowin, the company’s next HoloLens will be powered by the Snapdragon 850 Mobile Compute Platform, the same chipset that powers devices like the Samsung Galaxy Book 2. Using the Snapdragon 850 will mean the next HoloLens will be an Always Connected PC, allowing for instant-on functionality, as well as LTE connectivity thanks to the Snapdragon X20 4G LTE.

The device interestingly won’t feature Qualcomm’s latest Always Connected PC chipset, the Snapdragon 8cx, however. It’s not clear why exactly Microsoft is deciding to go with the Snapdragon 850 instead of the latest and greatest 8cx platform, though it’s possible the new chipset won’t be ready in time for Microsoft’s HoloLens release timeline.

Much like the current HoloLens, the company’s next HoloLens will be aimed at enterprise customers, so if you are hyped by it being an Always Connected PC, you may be a little disappointed. We are expecting a more comfortable, polish hardware this time around, though, so there could be something for everyone.

Tagged with Always Connected PC, HoloLens, Snapdragon 850, Snapdragon 8cx